Chair of Civil and Environmental Engineering
Walter P. Murphy Professor of Civil and Environmental Engineering
2145 Sheridan Road
Evanston, IL 60208-3109
Ph.D. Theoretical and Applied Mechanics, Northwestern University, Evanston, IL
M.S. Theoretical and Applied Mechanics, Northwestern University, Evanston, IL
B.S. Mathematics Jilin University, Changchun, Jilin, China
Dr. Qu’s research interest crosses several areas including micromechanics of composites, interfacial fracture and adhesion, fatigue and creep damage in metallic and polymer materials, fuel cells and batteries, thermomechanical reliability of microelectronic packaging, and ultrasonic nondestructive evaluation of advanced engineering materials. He has authored or co-authored two books and over 160 referred journal papers and book chapters in these areas. His research has been sponsored by various government agencies (NSF, ONR, USAF, US Army, DARPA, DoE, etc.) and private industries (Motorola, Ford Motor Co., IBM, AT&T, GE, Intel, AMD, Northrop Grumman, Rockwell, etc.).
- Outstanding Sustained Technical Contribution Award, Institute of Electrical and Electronics Engineers (IEEE), Components, Packaging, & Manufacturing Technology Society (CPMT), 2008
- Sigma Xi Best Paper Award, 2007
- ASME Electronic and Photonic Packaging Division Outstanding Contribution Award (Engineering Mechanics), 2006
- Changjiang Professorship, Beijing University, 2005-2008
- Fellow, American Society of Mechanical Engineers, 2001
- Water Arbitration Prize, Institute of Mechanical Engineers, UK, 2001
- Ralph R. Teetor Education Award, SAE, 1996
- Sigma Xi Young Faculty Award, 1994
- Dow Outstanding Young Faculty Award, ASEE, 1993
- Amoco Junior Faculty Teaching Excellence Award, Amoco Foundation, 1992
- Lilly Teaching Fellow, Lilly Endowment, 1992
Significant Professional Service
- Associate Editor, ASME Journal of Electronic Packaging, 2003–present
- Associate Editor, ASME Journal of Pressure Vessel Technology, 2010–present
- Associate Editor, Journal of Nondestructive Evaluation, 2011-present
In the Classroom
Professor Qu has taught courses at both the graduate and undergraduate levels, including statics, dynamics, mechanics of materials, machine design, fracture, elasticity, continuum mechanics, wave propagation in solids, variational methods in solid mechanics, micromechanics, and reliability of microelectronic packaging.
- Qu, J. and M. Cherkaoui, 2006, Fundamentals of Micromechanics of Solids, John Wiley & Sons Inc., Hoboken, NJ.
- Yang, S., Gao, F., Qu, J., 2013, “A Molecular Dynamics Study of Tensile Strength Between a Highly-Crosslinked Epoxy Molding Compound and a Copper Substrate,” Polymer, Vol. 54, pp. 5064 – 5074.
- Zhao, X., Duddu, R., Borda, S.P.A., and Qu, J., 2013, “Effects of Elastic Strain Energy and Interfacial Stress on the Equilibrium Morphology of Misfit Particles in Heterogeneous Solids,” J. Mech. Phys. Solids, Vol. 61, pp. 1433–1445.
- Cao, A. and Qu, J., 2013, “Atomistic Simulation Study of Brittle Failure in Nanocrystalline Graphene,” Applied Physic Letters, Vol. 102, pp. 071902.
- Cui, Z., Gao, F., and Qu, J., 2013, “Interface-Reaction Controlled Diffusion in Binary Solids with Applications to Lithiation of Silicon in Lithium Ion Batteries,” J. Mech. Phys. Solids., Vol. 61, pp. 293 - 310.
- Yang, S. and Qu, J., 2012, “Computing Thermomechanical Properties of Crosslinked Epoxy by Molecular Dynamic Simulations, Polymer, Vo. 53, pp. 4806 - 4817.
- Liu, M., Tang, G., Jacobs, L.J., and Qu, J., 2012, “Measuring acoustic nonlinearity parameter using collinear wave mixing,” J. Applied Physics, Vol. 112, 024908.
- Cao, A., and Qu, J., 2012, “Study on the Mechanical Behavior of Tilt Bicrystal Graphene by Molecular Dynamics Simulations: Bulk versus Nanoribbons,” J. Applied Physics, Vol. 112, pp. 043519.
- Cao, A., and Qu, J., 2012, “Size Dependent Thermal Conductivity of Single-Walled Carbon Nanotubes,” J. Applied Physics, Vol. 112, pp. 013503.
- Gao, F. and Qu, J., 2012, “Electrical Resistance at Carbon Nanotube/Copper Interfaces: Capped versus Open-end Carbon Nanotubes,” Materials Letters, Vo. 82, pp. 184–187.